"Thermal Shield" in the Biomedical Field
In the medical field, the application of 3D printing with high-temperature-resistant silicone is reshaping the design paradigm for implants. ACEO, a German company, has developed a conductive silicone material that can be 3D-printed into a smart sensor implant that can withstand 121°C steam sterilization. Once implanted, this device monitors physiological signals through the conductive silicone while also avoiding performance degradation caused by repeated sterilization due to its high-temperature resistance. A domestic medical company has used Elkem Silicones' AMSIL™ series of materials to print a burn dressing with a microchannel structure. Its high-temperature resistance allows the dressing to maintain structural integrity during laser treatment, significantly improving wound healing efficiency.
The "Thermal Customization" Revolution of Industry 4.0
With the advancement of Industry 4.0, 3D printing with high-temperature-resistant silicone is moving from prototyping to large-scale production. A fast-curing silicone ink developed by the Lawrence Livermore National Laboratory in the United States achieves one-step molding of overhanging structures through online mixing of catalysts and crosslinkers, reducing the development cycle for custom-shaped gaskets for automotive exhaust systems from eight weeks to three days. In the electronics field, 3D-printed silicone insulating brackets can withstand reflow temperatures of 200°C. Their complex internal heat dissipation channel design improves the heat dissipation efficiency of power devices by 40%, providing critical support for the miniaturization of electronic control systems in 5G base stations and new energy vehicles.
From rocket engines to human implants, the fusion of high-temperature silicone and 3D printing is redefining the boundaries of material applications in extreme environments. With continued innovation in material formulations and printing processes, this "thermal revolution" is poised to spawn even more disruptive applications.