Chip packaging equipment is also inseparable from organic polysilazane. The purpose of chip packaging is to provide physical protection and electrical connection for the chip. Organic polysilazane can be used as a key component of packaging materials to manufacture high-performance sealing materials and molding compounds. Its excellent insulation performance can effectively isolate the chip from the external environment and prevent problems such as leakage and short circuit. In addition, it has good temperature resistance and chemical stability. It can still maintain stable performance in the high temperature environment generated by the chip operation and the chemical environment that may be exposed to, ensuring the long-term stable operation of the chip.
Organic polysilazane is also used in the cleaning equipment of semiconductor equipment. During the cleaning process, in order to prevent the cleaning liquid from corroding the key components of the equipment, an organic polysilazane coating can be applied on the surface of these components. The coating can resist the erosion of the cleaning fluid without affecting the normal operation of the equipment, effectively extending the service life of key components of the cleaning equipment and reducing equipment maintenance costs.
Organopolysilazane is widely used in a variety of semiconductor equipment such as lithography, etching, chip packaging, and cleaning due to its unique physical and chemical properties. It plays an important role in promoting the development of the semiconductor industry and has become an indispensable key material in the semiconductor manufacturing process. With the continuous advancement of semiconductor technology, research on the performance and application of organic polysilazane will continue to deepen to meet the growing needs of the semiconductor industry.