As a class of polymer materials with unique structure and properties, organic polysilazane plays a critical role in the field of semiconductor equipment, especially in some equipment.
In the chip manufacturing process, photolithography equipment is a core part. The photolithography process has strict requirements on the performance of photoresist, and organic polysilazane has emerged here. It can be used as a tackifier for photoresist, significantly improving the adhesion between photoresist and substrate materials such as silicon wafers. During the photolithography process, photoresist needs to be accurately imaged. If the adhesion is insufficient, the photoresist pattern is prone to displacement or fall off, which seriously affects the manufacturing accuracy and performance of the chip. By adding organic polysilazane, the photoresist can be firmly attached to the substrate, ensuring the precise transfer of the photolithography pattern, helping to realize the increasingly sophisticated circuit pattern requirements in chip manufacturing, and is of great significance to improving the integration and performance of the chip.
Etching equipment is also a key equipment in semiconductor manufacturing. During the etching process, specific areas need to be accurately etched, while protecting other areas that do not need to be etched. Organic polysilazane can form a protective coating with excellent performance. With its good chemical stability and etching resistance, it can effectively block the etchant from corroding the non-etched area. This feature enables the etching depth and range to be accurately controlled in the etching of complex chip structures, avoiding damage to the surrounding circuit structure and ensuring the stability and reliability of the chip manufacturing process.