As a type of polysiloxane compound terminated or modified with epoxy groups, epoxy silicone oil has become a key additive in the field of resin crosslinkers due to its unique molecular structure and chemical activity. Its core advantage lies in the ring-opening reaction between epoxy groups and amino, hydroxyl and other functional groups in the resin molecular chain to form a three-dimensional crosslinking network, thereby accurately regulating the physical properties and processing characteristics of the resin.
In terms of performance optimization, epoxy silicone oil has shown multi-dimensional breakthroughs. The epoxy value range covers 0.1-0.9, and the crosslinking density can be customized for different resin systems. After adding this product to epoxy resin, the tensile strength of the material increases by 20%-35%, the elongation at break increases by 15%-25%, and the internal stress is reduced by more than 30%, which effectively solves the problem of high brittleness of traditional epoxy resin. In the polyurethane resin system, the introduction of epoxy silicone oil increases the peel strength of the adhesive from 8N/25mm to 15N/25mm, and extends the temperature resistance from 120℃ to 180℃, significantly expanding its application boundaries in the field of electronic packaging.
From the perspective of process adaptability, epoxy silicone oil is compatible with a variety of molding processes such as casting, dipping, and spraying with a wide viscosity range of 50-10000mPa·s. In the manufacture of composite materials, when it is used as an internal and external release agent, the number of demolding times is increased by 5-8 times compared with traditional wax release agents, and the surface finish of the product reaches Ra≤0.8μm. More importantly, the material can be stably stored for 12 months at 0-45℃, ensuring the continuity of industrial production and consistency of product quality.
At present, the penetration rate of epoxy silicone oil in the resin crosslinker market has exceeded 22%. With the surge in demand for high-performance materials in emerging industries such as 5G communications and new energy vehicles, its role as a "molecular scalpel" for resin modification will become increasingly important.