4. Adding additives
Corrosion-resistant fillers: Add an appropriate amount of corrosion-resistant fillers, such as nano-silicon dioxide, silicon carbide, etc., to the organic polysilazane. These fillers can be evenly dispersed in the polymer matrix to improve the hardness, wear resistance and corrosion resistance of the material. Nano-scale fillers can also fill tiny pores in the material, reduce the porosity of the material, and hinder the penetration of corrosive substances.
Antioxidants and UV absorbers: Adding antioxidants can prevent organic polysilazane from being oxidized in the air and improve the stability of the material. UV absorbers can absorb ultraviolet rays, reduce the damage of ultraviolet rays to the material, and prevent the material from being degraded due to ultraviolet radiation, thereby improving its corrosion resistance.
5. Optimizing packaging design
Increasing the thickness of the package: Properly increasing the thickness of the organic polysilazane packaging layer can increase the path length of corrosive substances penetrating to the chip surface, thereby improving corrosion resistance. However, the package thickness cannot be too large, otherwise it will affect the heat dissipation and other properties of the chip.
Design a reasonable package structure: Use a suitable package structure, such as multi-layer packaging, sealed packaging, etc., to reduce the possibility of corrosive substances entering the package. For example, setting a sealing rubber ring around the chip or using a multi-layer packaging structure, sandwiching a material with barrier properties in the middle, can effectively improve the corrosion resistance of the package.
6. Quality control and testing
Raw material quality control: Strict quality testing of the raw materials of organic polysilazane to ensure that the purity and performance of the raw materials meet the requirements. For example, testing indicators such as impurity content and molecular weight distribution in the raw materials to avoid affecting the corrosion resistance of the final product due to raw material quality problems.
Product performance testing: After the chip is packaged, a comprehensive performance test is performed on the packaged samples, including corrosion resistance test. By simulating the actual use environment, the packaged samples are subjected to salt spray tests, wet heat tests, etc., to detect the performance changes under different corrosion conditions, and to find problems and make improvements in a timely manner.