With the rapid development of artificial intelligence technology, the computing power demand of AI chips continues to rise, and power consumption also increases accordingly. Heat dissipation issues have become a key factor restricting the performance improvement of AI chips. Traditional heat dissipation materials can no longer meet the heat dissipation requirements of AI chips under high power density. High thermal conductivity silicone materials have emerged and become the new favorite for AI chip heat dissipation.
High thermal conductivity silicone materials, such as thermal conductive silicone sheets, thermal conductive silicone grease and thermal conductive gel, have excellent thermal conductivity and flexibility and elasticity. They can fill the air gaps between the heating device and the heat sink or metal base. These gaps are often the bottleneck of heat conduction due to the extremely low thermal conductivity of air. The application of high thermal conductivity silicone materials significantly reduces the interfacial thermal resistance and improves the heat dissipation efficiency.
In AI chip heat dissipation, high thermal conductivity silicone materials show unique advantages. They can cover uneven surfaces, adapt to complex packaging structures, and ensure that heat is effectively transferred from the heating device to the heat dissipation system. At the same time, these materials maintain stable operation in a wide temperature range (-45~200℃) and can withstand the heat generated by AI chips under long-term high-load operation.
As a representative of them, thermal conductive silicone sheets have become an ideal choice for internal and external heat dissipation of AI chip packages with their good flexibility and high thermal conductivity. Thermal conductive silicone grease, with its excellent wettability and fluidity, can fully fill the contact surface, form a low thermal resistance interface, and improve heat dissipation efficiency. Thermal conductive gel combines the advantages of the first two, and has good adhesion and automated dispensing capabilities, reducing production costs.
The application of high thermal conductivity silicone materials not only solves the problem of AI chip heat dissipation, but also improves the stability and service life of AI chips. With the continuous advancement of AI technology, high thermal conductivity silicone materials will play an increasingly important role in the field of AI chip heat dissipation. In the future, with the continuous development of materials science, the performance of high thermal conductivity silicone materials will be further improved, providing a more efficient and reliable solution for the heat dissipation of AI chips.